Chemical Mechanical Polishing(CMP); abrasive particle; modeling; wafer;
机械化学抛光； 磨粒； 建模； 芯片；
At least a part of the abrasive particles are arranged in the form of abrasive particle groups.
至少一部分磨蚀颗粒布置成磨蚀颗粒组的形式。
The study showed that when length of circular column part is 2.5 ~ 3.0 times outlet diameter, abrasive particle velocity near to 95% velocity of water-jet.
研究表明，当喷嘴的圆柱段长度是喷嘴出口直径的2 5 ~ 3 0倍时，粒子的速度能达到水射流速度的95%。
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